Back-plane, welded-wire technology is a packaging concept being used to replace conventional printed-circuit boards. Major reasons for pursuing welded-wire technology are 1) its greater density, which permits elimination of large multilayer printed-circuit boards, and 2) its adaptability to computer-aided design, which reduces drafting and manufacturing costs.
Nema pronađenih rezultata, molimo da izmjenite uslove pretrage i pokušate ponovo!
Ova stranica koristi kolačiće da bi vam pružila najbolje iskustvo
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