Calculation of thermodynamic properties Al-Ga-Sn ternary alloy using Muggianu and Toop Model
Since the 1960s, the rapid advancement of information technology (IT) infrastructure has been covered by the innovation of new electronic devices. This progress has not only accelerated industrial growth but also enhanced the quality of human life. Modern electronic devices are highly advanced and contain numerous components. Traditionally, Sn-Pb solder alloys have been the preferred choice due to their many advantages, such as ease of use, low melting point, favorable working conditions, good ductility, and excellent wetting properties on copper and its alloys. However, due to the toxic effects of lead on both health and the environment, limit the use of lead. As a result, the development of lead-free solder alternatives has been a focus for the past thirty years. To investigate new solder materials extensively, it's crucial to understand phase diagrams, phase equilibria, and melting points. Thermodynamic calculations and modeling are key in producing a consistent dataset and predicting thermodynamic properties. Muggianu Model and Model Toop were used to calculate the thermodynamic properties of Al-Ga-Sn liquid alloys. The predicted values were compared with the calculated results of the General Solution Model, and published experimental data confirm that the models are both accurate and practical.